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Title:
HOT-MELT ADHESIVE COMPOSITION FOR TILE CARPET AND TILE CARPET PREPARED BY USING THE SAME
Document Type and Number:
Japanese Patent JPH10176155
Kind Code:
A
Abstract:

To obtain a hot-melt adhesive compsn. which holds pile threads so firmly at high temps. that a high power is required for pulling the threads out by compounding an ethylene-vinyl acetate copolymer, a tackifying resin having a specified glass transition point, and wax having a specified m.p., each in a specified amt.

This compsn. is prepd. by compounding 100 pts.wt. ethylene-vinyl acetate copolymer having a melt flow rate (190°C, 2.16kgf) of 0.1-3,000g/10min with 10-1,700 pts.wt. tackifying resin having a glass transition point of 30°C or higher and selected from among aliph. hydrocarbon resins, arom. hydrocarbon resins, polyterpene resins, and rosin, 5-200 pts.wt. wax having an m.p. of 50°C or higher and selected from among polyethylene wax, paraffin wax, etc., and if necessary, an antioxidant, a weathering stabilizer, etc. After the compsn. is thermally melted and applied to a backing material, pile threads are planted under a load to the layer of the compsn., thus giving a pile carpet.


Inventors:
MIYAKE TAKESHI
Application Number:
JP33983396A
Publication Date:
June 30, 1998
Filing Date:
December 19, 1996
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
A47G27/02; C09J123/08; C09J131/04; (IPC1-7): C09J123/08; A47G27/02; C09J131/04