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Title:
HOT-MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2003119444
Kind Code:
A
Abstract:

To obtain a hot-melt adhesive composition that can inhibit threading, when it is applied with a nozzle.

An olefinic polymer that bears carboxy, acid anhydride and/or hydroxy groups and has high hydrogen bond-forming tendency is added to an ethylene-vinyl acetate copolymer, an ethylene-acrylic ester copolymer or their mixture in a small amount at a certain ratio to give the objective hot-melt adhesive composition.


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Inventors:
AONO MEGUMI
TOCHIGI SHIGETAKE
TABUCHI YOSHINOBU
SAKAKIBARA RYOHEI
Application Number:
JP2002192929A
Publication Date:
April 23, 2003
Filing Date:
July 02, 2002
Export Citation:
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Assignee:
YASUHARA CHEMICAL CO LTD
International Classes:
C09J123/08; C09J123/02; C09J129/04; C09J131/04; C09J133/02; C09J133/06; C09J135/00; C09J191/00; C09J201/00; (IPC1-7): C09J123/08; C09J123/02; C09J129/04; C09J131/04; C09J133/02; C09J133/06; C09J135/00; C09J191/00; C09J201/00
Attorney, Agent or Firm:
Shirai Shigetaka



 
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