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Title:
HOT-MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2006008761
Kind Code:
A
Abstract:

To provide a hot-melt adhesive composition with improved heat resistance and a hardly-disintegratable hot-melt adhesive composition suitable for recycling.

To 100 pts.wt. of a mixture comprising 20-90 wt% of an ethylene-vinyl acetate-vinylsilane copolymer in which the vinyl acetate content based on JIS K 6924-1 (1997 edition) is 20-50 wt% and the vinylsilane content is 0.01-2 wt% and 10-80 wt% of a hydrogenated tackifier, is added 0.01-1 pt.wt. of a silanol condensation catalyst, followed by crosslinking the ethylene-vinyl acetate-vinylsilane copolymer in the presence of water to obtain the hot-melt adhesive composition.


Inventors:
SAKANO HIROHIDE
Application Number:
JP2004184703A
Publication Date:
January 12, 2006
Filing Date:
June 23, 2004
Export Citation:
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Assignee:
TOSOH CORP
International Classes:
C09J123/08; C09J11/00; C09J131/04; C09J183/04
Domestic Patent References:
JPH01301740A1989-12-05
JPH09111214A1997-04-28
JPS5924767A1984-02-08
JPH07242865A1995-09-19