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Title:
HOT-MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JPH07118622
Kind Code:
A
Abstract:

PURPOSE: To provide the moist-hardening type hot-melt adhesive composition possible of melting at relatively low temperatures, having a low viscosity in a molten state and good in coating workability, rapidly solidifiable after coated and laminated with resultant good initial adhesive force manifestation, also presenting the final adhesive force and heat-resistant creep characteristics after moist-hardened.

CONSTITUTION: The objective adhesive composition comprises (1) an active NCO group-contg, urethane prepolymer prepared by reaction of a polyisocyanate compound with ≥50wt.% of (A) a crystalline polyester polyol 3000-10000 in number-average molecular weight and (2) another active NCO group-contg. urethane prepolymer prepared by reaction of a polyisocyanate compound with ≥10wt.% of (B) a crystalline polyester polyol 1000-3000 in number-average molecular weight, or comprises a third active NCO group-contg. urethane prepolymer prepared by reaction of a polyisocyanate compound with a mixed polyester polyol composed of ≥50wt.% of the component A and ≥10wt.% of the component B.


Inventors:
NOMURA SHIGERU
Application Number:
JP26867893A
Publication Date:
May 09, 1995
Filing Date:
October 27, 1993
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08G18/10; C08G18/12; C08G18/42; C09J175/00; (IPC1-7): C09J175/00
Domestic Patent References:
JPH03152112A1991-06-28
JPH02140284A1990-05-29



 
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