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Title:
HOT-MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JPH10130606
Kind Code:
A
Abstract:

To obtain a hot-melt adhesive compsn. excellent in high- and low-temp. adhesive properties and workability by combining two ethylene-vinyl acetate copolymers.

This compsn. comprises 5-60wt.% ethylene-vinyl acetate copolymer (A) and 95-40wt.% ethylene-vinyl acetate copolymer (B). Copolymer A has a melt index(MI) of 800-12,000g/10min, a vinyl acetate content (VA) of 5-20wt.%, a ratio (Mw/Mn) of wt. average mol.wt. (Mw) to number average mol.wt.(Mn) of 2.0-4.0, a content of low-molecular components having mol.wts. of 15,000 or lower of 24wt.% or lower, and an m.p.(MP) satisfying the relation: MP≥120-4.1[log(MI)]-1.33VA. Copolymer B has an MI of 10-800g/10min, a VA of 21-50wt.%, an Mw-Mn of 2.0-4.0, a content of the low-molecular components of 24wt.% or lower, and an MP satisfying the relation: MP≥120-4.1[log(MI)]-1.33VA. If necessary 100 pts.wt. compsn. may further contain up to 200 pts.wt. tackifier and/or up to 150 pts.wt. wax.


Inventors:
WATANABE ICHIGEN
Application Number:
JP30355096A
Publication Date:
May 19, 1998
Filing Date:
October 30, 1996
Export Citation:
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Assignee:
NIPPON UNICAR CO LTD
International Classes:
C09J123/08; C09J131/04; (IPC1-7): C09J123/08; C09J131/04
Attorney, Agent or Firm:
Nobuo Ono