To obtain a hot-melt adhesive compsn. excellent in heat resistance of adhesion by compounding an ethylene-vinyl acetate copolymer with a specific polymer.

This compsn. is prepd. by compounding 100 pts.wt. ethylene-vinyl acetate copolymer with 0.01-150 pts.wt. at least one polymer selected from among atactic polypropylene, an amorphous polyolefin, a fluoropolymer, and a poly(oxyalkylene) polymer. The ethylene-vinyl acetate copolymer has a melt index(MI) of 10-5,000g/10min, a vinyl acetate content (VA) of 5-50wt.%, a ratio (Mw/Mn) of wt. average mol.wt. (Mw) to number average mol.wt. (Mn) of 2.0-4.0, a content of low-molecular components having mol.wts. of 15,000 or lower of 24wt.% or lower, and an m.p.(MP) satisfying the relation: MP≥120-4.1[log(MI)]-1.33VA. If necessary up to 200 pts.wt. tackifier may be compounded into the above-prepd. compsn.