Title:
顆粒形態のホットメルト接着剤
Document Type and Number:
Japanese Patent JP2004531610
Kind Code:
A
Abstract:
A moisture-curing hot-melt-adhesive composition in granulate, tablet or powder form can be produced by a.) fusing the reactive hot-melt-adhesive composition and heating the melt, subject to exclusion of moisture, b.) extruding this melt through one or more dies onto a cooled surface, subject to exclusion of moisture, c.) cooling the granulate, subject to exclusion of moisture, whereby the composition solidifies, d.) removing the cooled hot-melt-adhesive granulate, e.) filling the granulate into moisture-tight packages, subject to exclusion of moisture. These reactive hot-melt adhesives are pourable and free-flowing and therefore can be used with all conventional application machines for hot-melt adhesives.
More Like This:
Inventors:
Hartmut Primke
Geralt Petri
Andrew Nixon
Hans-Peter Kohlstadt
Ingolf Schaeffler
Jürgen Wicherhaus
Michael crepes
Michael Rudolph
Geralt Petri
Andrew Nixon
Hans-Peter Kohlstadt
Ingolf Schaeffler
Jürgen Wicherhaus
Michael crepes
Michael Rudolph
Application Number:
JP2002587522A
Publication Date:
October 14, 2004
Filing Date:
April 30, 2002
Export Citation:
Assignee:
HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN
International Classes:
B29B9/10; C08G18/12; C08G18/40; C08J3/12; C09J4/00; C09J4/02; C09J201/00; C09J5/00; C09J5/06; C09J163/00; C09J175/04; C09J201/02; C09J201/10; (IPC1-7): C09J201/00; C09J4/00; C09J5/00; C09J163/00; C09J201/02; C09J201/10
Domestic Patent References:
| JPS61218631A | 1986-09-29 | |||
| JPS6295371A | 1987-05-01 | |||
| JP2000248249A | 2000-09-12 | |||
| JPH11320805A | 1999-11-24 | |||
| JPH09328668A | 1997-12-22 | |||
| JPH04202581A | 1992-07-23 | |||
| JPH11279515A | 1999-10-12 |
Other References:
新高分子文庫１６ ホットメルト接着剤の実際, vol. 初版, JPN6008049900, 20 May 1979 (1979-05-20), JP, pages 155 - 156, ISSN: 0001146402
Attorney, Agent or Firm:
Aoyama Aoi
Yasuo Shibata
Kenichi Morizumi
Shigehisa Takayama
Yasuo Shibata
Kenichi Morizumi
Shigehisa Takayama