To provide a hot melt adhesive applicable at low temperature, having high heat resistance.
The hot melt adhesive applicable at low temperature includes: 20-40 wt.% of a polymer blend (a) that contains an n-butylacrylate copolymer (i) comprising 15-35 wt.% of n-butylacrylate and an ethylene-vinylacetate copolymer (ii) comprising 10-45 wt.% of vinylacetate; 25-45 wt.% of a tackifier resin (b) having a softening point of 90-120°C; and 25-45 wt.% of a wax (c) having a melting point of 54-77°C, wherein the adhesive is based on the total weight of the wt.% (percent by weight). The adhesive has viscosity from 0.8 to 1.5 Pa s at adhesive-applying temperature of ≤121°C, wherein the heat stress value of the linked adhesive and the adhesive-applying temperature, shown by temperature at which stressed linking is broken, are separated by only 38°C(100°F).
MEHAFFY JUSTIN A
HANER DALE L
PATEL JAGRUTI
MORRISON BRIAN D
WILLYBIRO FIDELIN N
| JPH08253751A | 1996-10-01 | |||
| JPH08231935A | 1996-09-10 | |||
| JP2002003804A | 2002-01-09 | |||
| JPH11323288A | 1999-11-26 | |||
| JP2002356665A | 2002-12-13 | |||
| JP2001187874A | 2001-07-10 | |||
| JP2001187873A | 2001-07-10 | |||
| JPH08253751A | 1996-10-01 | |||
| JPH08231935A | 1996-09-10 | |||
| JP2002003804A | 2002-01-09 | |||
| JPH11323288A | 1999-11-26 | |||
| JP2002356665A | 2002-12-13 | |||
| JP2001187874A | 2001-07-10 | |||
| JP2001187873A | 2001-07-10 |
古賀 哲次
永坂 友康
石田 敬
青木 篤
高橋 正俊