Title:
ホットメルト接着剤
Document Type and Number:
Japanese Patent JP5850682
Kind Code:
B2
Abstract:
The present invention provides a hot melt adhesive for high-speed coating and spiral coating at low temperature. The hot melt adhesive has excellent adhesion to polyethylene and nonwoven fabric, and is suitable for disposable products. The hot melt adhesive comprises: (A) a propylene homopolymer having a melting point of 100° C. or lower which is obtainable by polymerizing propylene using a metallocene catalyst; and (B) an ethylene-based copolymer.
Inventors:
Moriguchi Masahiro
Shigekazu Saito
Shigekazu Saito
Application Number:
JP2011203063A
Publication Date:
February 03, 2016
Filing Date:
September 16, 2011
Export Citation:
Assignee:
Henkel Japan Ltd.
International Classes:
C09J123/12; A61F13/15; A61F13/472; C09J7/35; C09J11/08; C09J123/08; C09J191/00
Domestic Patent References:
| JP3199282A | ||||
| JP2005505679A | ||||
| JP2004034464A | ||||
| JP2001523301A |
Foreign References:
| WO2010032600A1 | ||||
| WO2003091289A1 |
Attorney, Agent or Firm:
Samejima Mutsumi
Kyousei Tamura
Fukumasa Mitsuru
Kyousei Tamura
Fukumasa Mitsuru