Title:
ホットメルト接着剤およびその使用
Document Type and Number:
Japanese Patent JP7368475
Kind Code:
B2
Abstract:
The invention is related to fast setting, bio-based hot melt adhesive compositions and use thereof. The bio-based hot melt adhesive compositions are based on renewable-based feedstock, making them environmentally friendly, and particularly suitable for sealing cardboard case, carton, and cardboards.
Inventors:
Hayes, Patrick
Harwell, Mitchell
Plummer, Jennifer
Harwell, Mitchell
Plummer, Jennifer
Application Number:
JP2021536104A
Publication Date:
October 24, 2023
Filing Date:
December 18, 2019
Export Citation:
Assignee:
Henkel AG & Co. KGaA
PURAC BIOCHEM B.V.
INGEVITY UK LTD.
PURAC BIOCHEM B.V.
INGEVITY UK LTD.
International Classes:
C09J167/00
Domestic Patent References:
JP2018532845A | ||||
JP2018532844A | ||||
JP5339557A | ||||
JP2017532404A | ||||
JP2022513303A |
Foreign References:
WO2017149019A1 | ||||
WO2010082639A1 |
Attorney, Agent or Firm:
Katsuhiro Ito
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