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Title:
ホットメルト組成物およびシール材
Document Type and Number:
Japanese Patent JP7268878
Kind Code:
B2
Abstract:
This Hot-Melt Composition Contains, Per (A) 100 Parts By Mass Of A Hydrogenated Styrene-Based Thermoplastic Elastomer Having A Styrene-Based Polymer Block At Both Ends Thereof And A Hydrogenated Diene Polymer Block At A Middle Portion Thereof, And Having A Mass-Average Molecular Weight Of 250,000-600,000, (B) 20-150 Parts By Mass Of A First Styrene-Based Tackifying Resin Having A Softening Point Of 135-160°C, (C) 100-400 Parts By Mass Of A Second Styrene-Based Tackifying Resin Having A Softening Point Of 105-135°C, (D) 100-500 Parts By Mass Of A Third Tackifying Resin For The Hydrogenated Diene Polymer Block And Having A Softening Point Of 100-160°C, And (E) 500-1,500 Parts By Mass Of A Liquid Softener. The Hot-Melt Composition Has Excellent Adhesiveness And Dismantlability, And Is A Material Suitable As A Sealing Material For An Illumination Device For A Car, Etc.

Inventors:
Tomonobu Yamauchi
Kazuya Furukawa
Daisuke Kimmon
Takashi Koga
Application Number:
JP2019535113A
Publication Date:
May 08, 2023
Filing Date:
July 30, 2018
Export Citation:
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Assignee:
Asahi Chemical Synthesis Co., Ltd.
International Classes:
C08L25/04; C08K5/01; C08L53/02; C08L57/02; C08L91/00; C09K3/10
Domestic Patent References:
JP2011162747A
JP2001271049A
JP11323296A
JP9286964A
JP2006143870A
JP8157794A
JP2010530905A
Attorney, Agent or Firm:
Maeda Suzuki International Patent Attorneys Corporation



 
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