HOT-MELT PRESSURE-SENSITIVE ADHESIVE COMPOSITION

Title:

HOT-MELT PRESSURE-SENSITIVE ADHESIVE COMPOSITION

Document Type and Number:

Japanese Patent JPH11106729

Kind Code:

A

Abstract:

To provide a hot-melt pressure-sensitive composition having excellent self-bonding performance at low temperatures, excellent corrugated board sealing properties at ordinary temperatures and low temperatures and, in addition, excellent stability with time while well maintaining appropriate adhesion, tack and permanence which a hot-melt pressure-sensitive composition comprising a polystyrene-based thermoplastic elastomer as the base polymer possesses.

Into a hot-melt pressure-sensitive composition comprising 100 pts.wt. polystyrene-based thermoplastic elastomer and 30-250 pts.wt. tackifying resin, at least one liquid polymer selected from the group consisting of a liquid ethylene-propylene copolymer and a liquid ethylene-propylene-non-conjugated diene copolymer which have a viscosity-average molecular weight of 5,000-9,000 is incorporated in an amount of 3-60 pts.wt. as the adhesion modifier.

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Inventors:

MATSUSHITA HIROMI
OIZUMI TAKASHI
HINO KINNOSUKE

Application Number:

JP28291997A

Publication Date:

April 20, 1999

Filing Date:

September 30, 1997

Export Citation:

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Assignee:

NICHIBAN KK

International Classes:

C09J153/00; C09J201/00; (IPC1-7): C09J153/00; C09J201/00

Attorney, Agent or Firm:

Nishikawa Shigeaki

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