Title:
ホットスタンピング金型装置
Document Type and Number:
Japanese Patent JP6647353
Kind Code:
B2
Abstract:
Provided is a hot stamping die apparatus including sub-assemblies constructed by making a plurality of plates erect and sequentially overlapping the plurality of plates in a face-to-face manner. A first cooling channel extending along overlapping surfaces is provided by forming grooves corresponding to each other on overlapping surfaces of adjacent plates, A second cooling channel passing through the corresponding sub-assembly in the length direction is provided in at least one of the sub-assemblies.
Inventors:
Lee Kengyu
Yang Daeho
Kim Jong Jin
Lee Tai Kei
Yang Daeho
Kim Jong Jin
Lee Tai Kei
Application Number:
JP2018153895A
Publication Date:
February 14, 2020
Filing Date:
August 20, 2018
Export Citation:
Assignee:
MS AUTOTECH CO.,LTD.
International Classes:
B21D24/00; B21D37/02; B21D37/16
Domestic Patent References:
| JP2013099774A | ||||
| JP2016147270A |
Foreign References:
| WO2012160703A1 | ||||
| US20060059971 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Onuki
Tadahiko Ito
Shinsuke Onuki