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Title:
HOT-STAMPING MOLDING DIE
Document Type and Number:
Japanese Patent JP2013099774
Kind Code:
A
Abstract:

To provide a hot-stamping molding die rapidly cooling a molded panel in time of the molding of the panel by use of a hot-stamping method.

This hot-stamping molding die includes: a base plate capable of receiving the supply of cooling water and discharging it; at least one outer shape block mounted on one face of the base plate according to the shape of a product, and formed with a mounting space thereinside; and an insert block inserted into the mounting space, fixed to the outer shape block, and mounted on the one face of the base plate. The insert block is fixed to the outer shape block in a state that a plurality of passages for circulating the cooling water are formed on the peripheral face close to the outer shape block, and the plurality of passages are connected to the base plate such that a fluid flows.


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Inventors:
LEE SEUNG SANG
Application Number:
JP2012094742A
Publication Date:
May 23, 2013
Filing Date:
April 18, 2012
Export Citation:
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Assignee:
HYUNDAI MOTOR CO LTD
International Classes:
B21D24/00; B21D37/16; B21D22/20
Domestic Patent References:
JP2009543697A2009-12-10
JP2005007442A2005-01-13
Foreign References:
US8047037B22011-11-01
US20060059971A12006-03-23
EP1749593A22007-02-07
US8047037B22011-11-01
US20060059971A12006-03-23
EP1749593A22007-02-07
Attorney, Agent or Firm:
Kyosei International Patent Office



 
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