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Title:
HOT WATER SUPPLY DEVICE
Document Type and Number:
Japanese Patent JP2008223589
Kind Code:
A
Abstract:

To provide a hot water supply device, in which circuit breakage caused by increase in water temperature in a pump for the hot water supply device in increase in water temperature and increase in the temperature of a motor winding is prevented, pump efficiency is improved, and the size of the pump is reduced.

The hot water supply device 100 comprises: a heat exchanger 3 exchanging heat between refrigerant and water; a tank 1 reserving water; the pump 2 circulating the water and mounting a brushless DC motor thereon; and a control circuit 9 controlling the pump 2, and disposed to the outside of the pump 2. The control circuit 9 performs a magnetic pole position detection sensorless control of the brushless DC motor, and makes it drive in an optimum conduction phase depending on the revolution speed.


Inventors:
KAWAKUBO MAMORU
ASO HIROKI
YAMAZAKI TOGO
YAMADA TOMOO
YAMAMOTO MINEO
ISHII HIROYUKI
Application Number:
JP2007062873A
Publication Date:
September 25, 2008
Filing Date:
March 13, 2007
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
F04D15/00; F04D13/06; F04D29/00; F24H1/00; F24H1/18; F24H4/02; H02P6/06; H02P6/08; H02P6/17; H02P6/18; H02P6/182; H02P6/28
Domestic Patent References:
JP2008193877A2008-08-21
JPH07337067A1995-12-22
JP2001276485A2001-10-09
JP2006525460A2006-11-09
Attorney, Agent or Firm:
Shoji Mizoi