Title:
HOUSING, METHOD OF MANUFACTURING HOUSING, AND ELECTRONIC APPARATUS USING THE SAME
Document Type and Number:
Japanese Patent JP2009182960
Kind Code:
A
Abstract:
To provide a housing which has a simple structure, a small volume and an antenna pattern installed inside, and to provide a method of manufacturing the housing and an electronic apparatus using the same.
The housing includes a substrate layer and an antenna installed to the substrate layer. The antenna is a metal layer formed on the substrate layer by electroplating.
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Inventors:
YANG FU-KENG
CHO HEI
ZENG YI-PING
ZHAN JIAN-JUN
CHO HEI
ZENG YI-PING
ZHAN JIAN-JUN
Application Number:
JP2009007008A
Publication Date:
August 13, 2009
Filing Date:
January 15, 2009
Export Citation:
Assignee:
SHENZHEN FUTAIHONG PREC IND CO
SUTECH TRADING LTD
SUTECH TRADING LTD
International Classes:
H01Q1/38; B29C45/17; H01Q1/24; H04M1/02
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro