Title:
HOUSING STRUCTURE FOR BOARD
Document Type and Number:
Japanese Patent JP3911995
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a housing structure for a board at a low cost which is not liable to separation of a case body from a case cover and having a fixing means of a printed board.
SOLUTION: Semiconductor recess 13a and 13b of a board 14 of a printed board 2 are disposed on a stepwise surfaces 7a and 7b, made of substantially semiconductor cutout end faces of mounting holes 6a and 6b of the case body 3, so as to be coaxial with the holes 6a and 6b, and ends of cutouts 23a and 23b of the board 14 are contacted with rising surfaces 8a and 8b the stepwise surfaces 7a and 7b. Since directions of the surfaces 8a and 8b to the board 14 are different from each other, the board 2 becomes a structure strong against vibration, a deviation or the like in a parallel direction with respect to the surface of the board, and a position of the parallel direction to the surface of the board can be fixed.
Inventors:
Hiroyuki Sako
Shigeaki Yamazaki
Yoshihide Imaoka
Shimizu Shigeo
Shigeaki Yamazaki
Yoshihide Imaoka
Shimizu Shigeo
Application Number:
JP2000363453A
Publication Date:
May 09, 2007
Filing Date:
November 29, 2000
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
H05K5/00; H05K7/14; (IPC1-7): H05K7/14; H05K5/00
Domestic Patent References:
| JP58085838U | ||||
| JP5050789U | ||||
| JP9069197A | ||||
| JP6012589A |
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori
Atsuo Mori
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