Title:
ダイを基板に取り付ける方法及び装置
Document Type and Number:
Japanese Patent JP2008504716
Kind Code:
A
Abstract:
A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method includes depositing a plurality of contacts of bonding material between the substrate and die, and forming a bond between the die and the housing by applying at least 25,000 kilograms of force per gram of bonding material to the housing, the contacts, and the die.
Inventors:
Deecamp, John Bee
Glenn, Max Sea
Dunaway, Lori A
Curtis, Harlan El
Glenn, Max Sea
Dunaway, Lori A
Curtis, Harlan El
Application Number:
JP2007519359A
Publication Date:
February 14, 2008
Filing Date:
June 28, 2005
Export Citation:
Assignee:
Honeywell International Inc.
International Classes:
H01L21/52; B81B7/00; G01C19/5719; H01L21/60; H01L21/603
Attorney, Agent or Firm:
Kazuo Shamoto
Shinjiro Ono
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Otsuka Sumie
Shinjiro Ono
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Otsuka Sumie