Title:
栓がされ密封されたチャンバを有するウエハー対を製造する方法
Document Type and Number:
Japanese Patent JP5775617
Kind Code:
B2
Abstract:
A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low pressure environment, thus assuring the same kind of environment in the sealed chamber. The chamber may enclose at least one device such as a thermoelectric sensor, bolometer, emitter or other kind of device. The wafer-pair typically will have numerous chambers, with devices, respectively, and may be divided into a multiplicity of chips.
Inventors:
Utd, Earl.Andrew
Ridley, JF Aye.
Higashi, Robert E.
Ridley, JF Aye.
Higashi, Robert E.
Application Number:
JP2014047559A
Publication Date:
September 09, 2015
Filing Date:
March 11, 2014
Export Citation:
Assignee:
Honeywell International Inc.
International Classes:
G01J1/02; H01L21/02; B29C43/56; B81B1/00; H01L27/16; H01L35/34; H01L37/00; H01L37/02
Domestic Patent References:
| JP9506712A | ||||
| JP6249708A | ||||
| JP5157622A | ||||
| JP52032269A |
Attorney, Agent or Firm:
Shinjiro Ono
Yasushi Kobayashi
Shigeo Takeuchi
Osamu Yamamoto
Yasushi Kobayashi
Shigeo Takeuchi
Osamu Yamamoto