Title:
積層パッケージングを使用して包囲されたセンサ構造体を保護する方法
Document Type and Number:
Japanese Patent JP4944365
Kind Code:
B2
Abstract:
A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, in which the micro-mechanical sensor structure is fabricated with a protective membrane, the micro-mechanical sensor chip is arranged so that a surface of the protective membrane faces toward a second chip, and the micro-mechanical sensor chip is secured to the second chip.
Inventors:
Karlsten Funk
Application Number:
JP2004090265A
Publication Date:
May 30, 2012
Filing Date:
March 25, 2004
Export Citation:
Assignee:
ROBERT BOSCH GMBH
International Classes:
G01P15/08; H01L29/84; B81B3/00; B81B7/00; B81C1/00; G01C19/56; G01C19/5769; G01P1/02; G01P15/125; G01P15/18
Domestic Patent References:
| JP11067820A | ||||
| JP2000131169A | ||||
| JP2001235485A | ||||
| JP4332871A | ||||
| JP2000049357A | ||||
| JP11094506A | ||||
| JP8274350A | ||||
| JP7007162A | ||||
| JP7099326A |
Foreign References:
| WO2001077008A1 | ||||
| US4945769 |
Attorney, Agent or Firm:
Toshio Yano
Einzel Felix-Reinhard
Einzel Felix-Reinhard