Title:
半導体温度センサ回路,半導体集積回路および半導体温度センサ回路の調整方法
Document Type and Number:
Japanese Patent JP4910127
Kind Code:
B2
Inventors:
Masahiro Sasaki
Kunihiro Asada
Makoto Ikeda
Kunihiro Asada
Makoto Ikeda
Application Number:
JP2006058740A
Publication Date:
April 04, 2012
Filing Date:
March 03, 2006
Export Citation:
Assignee:
National University Corporation Tokyo University
International Classes:
G01K7/01; H01L21/822; H01L27/04
Domestic Patent References:
| JP9119870A | ||||
| JP10122976A | ||||
| JP4503861A |
Other References:
Vladimir Szekely et al.,CMOS Sensors for On-Line Thermal Monitoring of VLSI Circuits,IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS,IEEE,1997年,Vol.5, No.3,p.270-276
Attorney, Agent or Firm:
Mamoru Ushiki
Shimizu Sakaematsu
Masayoshi Yoshida
Shimizu Sakaematsu
Masayoshi Yoshida