Title:
封筒束および封筒束のパッケージの組立方法
Document Type and Number:
Japanese Patent JP2008512321
Kind Code:
A
Abstract:
An envelope package including a plurality of generally aligned envelopes, the plurality of envelopes being compressed together. The package further includes a generally non-elastic band extending around the plurality of compressed envelopes and retaining the envelopes in a state of compression. Each envelope is generally flat and planar in the absence of outside forces, and the band retains the plurality of envelopes in a limited state of compression such that none of the banded envelopes are pulled out of plane by more than about 1/40 of the length of that envelope to reduce warpage thereof.
Inventors:
Carrigan, David, Jay
Witold, Michaszek
Witold, Michaszek
Application Number:
JP2007531433A
Publication Date:
April 24, 2008
Filing Date:
September 12, 2005
Export Citation:
Assignee:
Mead West Beco Corporation
International Classes:
B65B27/08; B65B13/20
Foreign References:
| US2917884A | 1959-12-22 | |||
| US2691922A | 1954-10-19 | |||
| US6550221B1 | 2003-04-22 | |||
| US4184628A | 1980-01-22 | |||
| US2996859A | 1961-08-22 | |||
| US20020033570A1 | 2002-03-21 |
Attorney, Agent or Firm:
Suenari Mikio