Title:
センサの組立方法
Document Type and Number:
Japanese Patent JP4751085
Kind Code:
B2
Inventors:
Nobuyuki Okamura
Takao Sagawa
Arakane Hiroomi
Takao Sagawa
Arakane Hiroomi
Application Number:
JP2005103917A
Publication Date:
August 17, 2011
Filing Date:
March 31, 2005
Export Citation:
Assignee:
Tokyo Keiki Co., Ltd.
International Classes:
G01C19/00; G01P15/18; G01P21/00; G01P21/02
Domestic Patent References:
| JP2003028646A | ||||
| JP2002310660A | ||||
| JP10002914A | ||||
| JP2005106749A | ||||
| JP2004347587A | ||||
| JP2004170380A | ||||
| JP11211481A | ||||
| JP7306047A | ||||
| JP5119058A | ||||
| JP5023140U |
Attorney, Agent or Firm:
Hisako Ishido
Hideo Akazawa
Eiichi Yamaguchi
Hideo Akazawa
Eiichi Yamaguchi