Title:
How to assign electronic parts and an electronic packaging system
Document Type and Number:
Japanese Patent JP6043873
Kind Code:
B2
Abstract:
The present specification discloses a method of allocating electronic components to be mounted to each of a plurality of nozzle holders provided on a mounting head. In the method, the electronic component which does not have a usage record or the electronic component which is a test target is allocated to a nozzle holder which does not have operation restrictions. The present specification also discloses an electronic component mounting system which is provided with a mounting head which is provided with a plurality of nozzle holders, each of which holds a suction nozzle, and a control device which allocates electronic components to be mounted to each of the plurality of nozzle holders. In the electronic component mounting system, the control device includes an electronic component allocation section which allocates an electronic component which does not have a usage record or an electronic component which is a test target to a nozzle holder which does not have operation restrictions.
Inventors:
Mitsuru Sanji
Application Number:
JP2015526048A
Publication Date:
December 14, 2016
Filing Date:
July 09, 2013
Export Citation:
Assignee:
Fuji Machine Manufacturing Co., Ltd.
International Classes:
H05K13/04
Domestic Patent References:
| JP2004304120A | 2004-10-28 | |||
| JP2000183597A | 2000-06-30 | |||
| JPH05114799A | 1993-05-07 | |||
| JP2003258494A | 2003-09-12 |
Attorney, Agent or Firm:
Kaiyu International Patent Office