Title:
半導体装置用ソケットおよび半導体装置のソケットへの取付け方法
Document Type and Number:
Japanese Patent JP3566691
Kind Code:
B2
Abstract:
A socket (10) has a base member (20), a cover member (30) which is mounted for alternating motion toward and away from base member (20), a plurality of contacts (40) having an end fixed to the base member (20), a contact regulating member (50) that regulates the position of the movable ends (42, 92) of the contact and an adaptor (60) having a seating surface, the adaptor which is mounted for alternating motion toward and away from the contact regulating member (50). When adaptor (60) is removed from the contact regulating member, the movable ends of the contacts do not protrude through the seating surface and when adaptor (60) has been moved toward the contact regulating member (50), the movable ends of the contacts protrude from each through-hole (65) of adaptor (60) for engagement with the solder balls of a BGA device (11), placed on the adaptor (60). The cover member is linked to the base member and latches (70) having a BGA device pressing tip (72) are rotatable with movement of the cover. The latches have a first fulcrum (75) for a first segment of motion and a second different fulcrum (71) for a second segment of motion.
Inventors:
Hideki Sano
Kiyokazu Ikeya
Kiyokazu Ikeya
Application Number:
JP2001382485A
Publication Date:
September 15, 2004
Filing Date:
December 17, 2001
Export Citation:
Assignee:
Texas Instruments Japan Ltd.
International Classes:
H01R13/24; H01R33/76; (IPC1-7): H01R33/76
Domestic Patent References:
| JP200386319A |
Attorney, Agent or Firm:
Kyozo Katayose