Title:
【発明の名称】集積回路ダイの数を効率的に計算する方法
Document Type and Number:
Japanese Patent JP2003518769
Kind Code:
A
Abstract:
A method and system thereof for efficiently computing the number of dies per wafer and the corresponding number of stepper shot counts. Dimensions for a die and the size of the wafer are received. The dimensions comprise a die element size that is a function of a scribe lane width, a guard ring width, an input/output pad area, and a length and a width of the die. A die count lookup table is selected for the specified wafer size and used to determine the die count corresponding to the die element size. In a similar manner, a stepper shot count lookup table is selected for the specified wafer size and used to determine the stepper shot count corresponding to the die element size. The axes of the die count and stepper shot count lookup tables are incremented by varying amounts; for example, the increments in one portion of the lookup tables are smaller (finer), and in another portion the increments are larger (grosser). By using larger increments in portions of the lookup tables, the amount of data in the tables can be reduced, making the tables easier to generate and work with.
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Inventors:
Michael Earl Maggie
Michael dee beer
Wesley, Earl Elk
Michael dee beer
Wesley, Earl Elk
Application Number:
JP2001548430A
Publication Date:
June 10, 2003
Filing Date:
October 11, 2000
Export Citation:
Assignee:
Konin Krekka Philips Electronics NV
International Classes:
G03F7/20; H01L21/02; (IPC1-7): H01L21/02
Attorney, Agent or Firm:
Kenji Yoshitake (4 others)