Title:
センサ装置ならびにセンサ装置におけるセンサ素子および端子板の接続方法
Document Type and Number:
Japanese Patent JP6780986
Kind Code:
B2
Abstract:
A sensor device and a method of connecting a sensor element and terminal plates in the sensor device are provided. An end of the sensor device at the length direction of a holder extending in a straight line manner is fixed to the sensor element. The sensor element is provided with a pair of terminals extending along the length direction of the holder. The holder and the sensor element are coveredwith a shell made of resin. The sensor device can be automatically assembled easily. The holder (11) is provided with through holes (28). The through holes are used for performing resistance weldingon ends (14f) of a pair of metal-made terminal plates (14) fixed to the holder (11) corresponding to the pair of terminals (13), and the terminals (13) of the sensor element (12) in a laminated state.A coupler part (15a) facing the other ends (14g) of the terminal plates (14) is integrally formed on one end, opposite to the sensor element (12), of the shell (15) covering the holder (11), the sensor element (12) and the pair of terminal plates (14).
Inventors:
Nei Keito
Application Number:
JP2016174574A
Publication Date:
November 04, 2020
Filing Date:
September 07, 2016
Export Citation:
Assignee:
Honda Lock Co., Ltd.
International Classes:
G01D5/12; G01P1/02
Domestic Patent References:
| JP2008209198A | ||||
| JP2002357455A | ||||
| JP2004251629A | ||||
| JP2000180459A | ||||
| JP200366057A | ||||
| JP2001174471A | ||||
| JP2004264213A | ||||
| JP2001174470A |
Foreign References:
| US20030080730 |
Attorney, Agent or Firm:
Ochiai Patent Office