Title:
How to control curvature of material by use of a differential pressure method
Document Type and Number:
Japanese Patent JP6263297
Kind Code:
B2
Abstract:
A method for suppressing material warpage by means of a pressure difference comprises the following steps: a. preparing a plurality of carrier boards; b. preparing a plurality of carrier board pressing devices having an upper surface and a lower surface on which at least one air bag is provided; c. adjusting the processing chamber to be a working temperature and a working pressure, so that the carrier boards and the carrier board pressing devices placed therein are surrounded by the working temperature and the working pressure; d. effectively suppressing warpage of the carrier board by using a pressure difference between a first predetermined pressure in the air bag and the working pressure of the processing chamber. Thereby, production quality of carrier board is significantly improved, as well as the cost for production of which is effectively reduced.
Inventors:
Hong Shu-hui
Application Number:
JP2017086817A
Publication Date:
January 17, 2018
Filing Date:
April 26, 2017
Export Citation:
Assignee:
Indo Mining Technology Co., Ltd.
International Classes:
H01L21/673; H01L21/02
Domestic Patent References:
| JP10275852A | ||||
| JP2015065298A | ||||
| JP2015079832A |
Attorney, Agent or Firm:
Hiroharu Kitahara
Satoshi Yamauchi
Seiko Ito
Satoshi Yamauchi
Seiko Ito