Title:
ポリマー基板中にトレンチ構造を作成する方法
Document Type and Number:
Japanese Patent JP2005532677
Kind Code:
A
Abstract:
In order to produce a trench structure having steep sidewalls free of residues in an, in particular, glass-fiber-reinforced substrate, the substrate is provided with a conformal mask having cutouts corresponding to the trench structure to be produced. In this case, the laser beam is guided over the cutouts of the mask in such a way that the low-energy edge regions of the laser beam are shielded and that proportion of the laser beam which impinges on the polymer surface, at each point, has an energy density above a threshold at which the substrate material including a glass fiber reinforcement that is possibly present is completely removed.
Inventors:
Stephan Les Yack
Hubert de Stour
Waypan
Hubert de Stour
Waypan
Application Number:
JP2004502686A
Publication Date:
October 27, 2005
Filing Date:
April 01, 2003
Export Citation:
Assignee:
Siemens Aktiengesellschaft
International Classes:
B23K26/06; B23K26/18; B23K26/38; B23K26/40; H01S3/00; H05K3/00; B23K101/42; H05K1/02; H05K1/03; (IPC1-7): H05K3/00; B23K26/06; B23K26/38; H01S3/00
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel