Title:
室温硬化性オルガノポリシロキサン組成物の硬化方法
Document Type and Number:
Japanese Patent JP4840602
Kind Code:
B2
Abstract:
A room temperature curable organopolysiloxane composition is provided. This composition comprises (A) a diorganopolysiloxane endcapped at both ends of the molecular chain with hydroxy group represented by the following formula: HO-(R2SiO)n-H wherein R represents a monovalent hydrocarbon group, and n represents an integer of at least 10, (B) an organopolysiloxane comprising R13SiO1/2 unit, R12SiO2/2 unit, and R1SiO3/2 unit wherein R1 represents a monovalent hydrocarbon group, and SiO4/2 unit with the proviso that molar ratio of R13SiO1/2 unit to SiO4/2 unit is in the range of 0.6 to 1.2, molar ratio of R12SiO2/2 unit to SiO4/2 unit and molar ratio of R1SiO3/2 unit to SiO4/2 unit are both in the range of 0 to 1.0, and content of the silanol group is less than 1.5% by weight, (C) surface treated fumed silica, (D) a silane and/or its hydrolysate containing at least two hydrolyzable groups in the molecule, and (E) a curing catalyst.
Inventors:
Tsuneo Kimura
Application Number:
JP2007244936A
Publication Date:
December 21, 2011
Filing Date:
September 21, 2007
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08G77/06; C08G77/44; C08K9/06; C08L83/06
Domestic Patent References:
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Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa