Title:
熱剥離型粘着テープ及び電子部品の切断方法
Document Type and Number:
Japanese Patent JP5778721
Kind Code:
B2
Abstract:
The invention relates to a thermal-release adhesive tape and a cutting method of an electronic component. An object of the invention is to provide an adhesive tape capable of fully fixing a chip even when being cut off, preventing chip flyoff in a cutting process, and increasing yield of the chip in the cutting process. The thermal-release adhesive tape has a thermal-expansion adhesive layer. When a probe tack value of the thermal-expansion adhesive is set as B0 and the probe tack value of the thermal-expansion adhesive after being stood for 1 week at a temperature of 0 DEG C as B, a variable rate of the probe tack value shown as a formula 1 is below 19.0%. W=|(B0-B)/B0*100|
Inventors:
Kazuhiro Kitayama
Daisuke Shimokawa
Takamasa Hirayama
Kazuki Soejima
Daisuke Shimokawa
Takamasa Hirayama
Kazuki Soejima
Application Number:
JP2013151139A
Publication Date:
September 16, 2015
Filing Date:
July 19, 2013
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C09J7/02; C09J11/06; C09J133/08; C09J201/00; H01L21/301
Domestic Patent References:
| JP2003160765A | ||||
| JP2008045011A | ||||
| JP2010214947A | ||||
| JP2005314708A | ||||
| JP2004018604A | ||||
| JP2005330406A | ||||
| JP2002069410A | ||||
| JP2009246302A |
Foreign References:
| WO2008133120A1 | ||||
| WO2008133118A1 | ||||
| WO2012014821A1 |
Attorney, Agent or Firm:
Zentaro Hasebe
Yasuyuki Yamada
Yasuyuki Yamada