Title:
一連の切断動作中にワイヤソーによって被加工物から複数のスライスを切断する方法
Document Type and Number:
Japanese Patent JP7466006
Kind Code:
B2
Abstract:
Slices are cut from workpieces during a sequence of cut-off operations by a wire saw, having a wire array. The wire array is tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. During each cut-off operation, a workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed with simultaneous axial movement of the floating bearings by adjusting a temperature of the fixed bearings in correlation with a first correction profile, which specifies a travel of the floating bearings in dependence on the depth of cut. In dependence on the depth of cut, operating parameters are set, such as the feed rate, an amount of working fluid fed to the wire array per unit time, a temperature of the working fluid, a wire speed, a wire consumption per cut-off operation, or a wire tension.
Inventors:
Buyer, accelerator
Berger, patrick
Dietz, Wolfgang
Flintart, curl
Gunther, Matthias
Berger, patrick
Dietz, Wolfgang
Flintart, curl
Gunther, Matthias
Application Number:
JP2022576168A
Publication Date:
April 11, 2024
Filing Date:
May 27, 2021
Export Citation:
Assignee:
Siltronic AG
International Classes:
B24B27/06; B23D57/00; B23D59/00; B23D61/18; B24B49/12; B24B55/02; B24B57/02; B28D5/04; B28D7/00; B28D7/02; H01L21/304
Domestic Patent References:
| JP2005103683A | ||||
| JP8323741A | ||||
| JP2015020235A | ||||
| JP2015212007A |
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office