How to deal with a semiconductor wafer - Shin-Etsu Polymer Co., Ltd.

Title:

How to deal with a semiconductor wafer

Document Type and Number:

Japanese Patent JP6013744

Kind Code:

B2

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Inventors:

Satoshi Odashima
Noriyoshi Hosono

Application Number:

JP2012041038A

Publication Date:

October 25, 2016

Filing Date:

February 28, 2012

Export Citation:

Assignee:

Shin-Etsu Polymer Co., Ltd.

International Classes:

H01L21/683

Domestic Patent References:

Attorney, Agent or Firm:

Eisuke Fujimoto
Masayoshi Kanda
Akio Miyao
Nobuyuki Baba

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