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Title:
ポリビニルアンモニウム化合物、ポリビニルアンモニウム化合物の製造方法、ポリビニルアンモニウム化合物を含有する酸性溶液及び銅めっきを電気分解的に析出する方法
Document Type and Number:
Japanese Patent JP2008533224
Kind Code:
A
Abstract:
The invention relates to a polyvinylammonium compound, to a method of manufacturing said compound, to an aqueous acidic solution containing at least said Polyvinylammonium compound for electrolytically depositing a copper deposit as well as to a method of electrolytically depositing a copper deposit using said aqueous acid solution, said polyvinylammonium compound corresponding to the general chemical formula (1): as well as to polyvinylammonium compounds of the general chemical formula (1), wherein one of the monomer units or both having indices l and m are present in the neutral form.

Inventors:
Dahms Wolfgang
Hartmann Philip
Greezer Wood
Application Number:
JP2008500108A
Publication Date:
August 21, 2008
Filing Date:
March 01, 2006
Export Citation:
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Assignee:
Atotehi Deutschland Gesellschaft Mitt Beschlenktel Haftung
International Classes:
C08F26/02; C08F8/00; C25D3/38; C25D7/00; C25D7/12
Domestic Patent References:
JPS57114685A1982-07-16
JP2004307991A2004-11-04
JP2005029818A2005-02-03
JPS5275621A1977-06-24
JPH07328323A1995-12-19
Foreign References:
US3502551A1970-03-24
Attorney, Agent or Firm:
Fujita Akira