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Title:
廃プリント基板の処理方法
Document Type and Number:
Japanese Patent JP5058859
Kind Code:
B2
Abstract:

To provide a method for treating a waste printed circuit board by which the waste printed circuit board is efficiently treated and further is changed to more worthy valuables.

The method for treating the waste printed circuit board includes a first process where the waste printed circuit board which is roughly crushed in advance and used as a raw material, is charged into a rotary kiln, and heated with superheated steam so as to carbonize the part except included metals, a second process where the waste printed circuit board treated in the first process is crushed to obtain the powder containing carbonized products and ceramics and other particulates consisting of metals, and a third process for separating the particulates from the powder, produced in the second process.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
Mikio Harada
Takaaki Tsumura
Tokuda Satoshi
Application Number:
JP2008074088A
Publication Date:
October 24, 2012
Filing Date:
March 21, 2008
Export Citation:
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Assignee:
Nippon Magnetic Separation Co., Ltd.
International Classes:
B09B3/00; B02C17/04; B09B5/00; C22B7/00; C22B11/02; C22B15/00
Domestic Patent References:
JP9052079A
JP2008194618A
JP8071521A
JP2000301131A
JP3602504B2
JP7155630A
JP2909503B2
Attorney, Agent or Firm:
Fujio Nakamae
Yoshihiro Kurita



 
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