Title:
ハニカムサンドイッチパネルの充填および強化方法
Document Type and Number:
Japanese Patent JP4273480
Kind Code:
B2
Abstract:
The present invention relates to a process for the fast and efficient filling of voids of both simple and complex shape which can be carried out at room temperature. In particular, the present invention consists of the use of free flowing thermally expanding and curing powders which are poured into the voids and then heated causing the powder to expand, coalesce and cure and thus filling or partially filling the void space as required. The process according to the present invention is particularly suitable for filling the spaces in, around and between honeycomb or pre-formed foam cores as required to produce a filled or partially filled honeycomb or foam core or any other material used in sandwich panel construction. This process is also a simple and efficient method for filling moulds suitable for use in cellular artefact production. The filled or partially filled mould or honeycomb core can then be cured to produce bonded sandwich panels or moulded cellular artefacts. In sandwich panel construction the core material can be bounded by one or more surface skins and the cured bonded panel can be cut to provide a panel having pre-sealed edges.
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Inventors:
Dean Anthony Bug
Barry James Hayes
Barry James Hayes
Application Number:
JP2000578146A
Publication Date:
June 03, 2009
Filing Date:
September 16, 1999
Export Citation:
Assignee:
HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH
International Classes:
B32B3/12; B29C44/00; B29C44/18; B29C67/04; B29K63/00; B29K67/00; B29K77/00; B29L9/00
Domestic Patent References:
| JP4027900Y1 | ||||
| JP5833223U | ||||
| JP361581B2 | ||||
| JP772233B2 |
Attorney, Agent or Firm:
Calyx
Toshio Nakamura
Miyazaki Yoshio
Tsutomu Kato
Toshio Nakamura
Miyazaki Yoshio
Tsutomu Kato