Title:
木製ボードの仕上げ方法
Document Type and Number:
Japanese Patent JP6377852
Kind Code:
B2
Abstract:
The disclosure relates to a method for finishing a wood board with an upper face and a lower face. A layer of liquid synthetic resin is first applied at least onto the upper face or the lower face, and at least one paper ply soaked with a synthetic resin is then applied. The structure is then pressed in a press under high pressure and at a high temperature, wherein the synthetic resin melts and is connected to the upper face or the lower face of the wood board. The invention is characterized in that the upper face and/or the lower face is provided while still having a press skin and in an ungrounded state, and the layer is applied so thinly that the liquid synthetic resin is completely drawn into the press skin, the layer is not actively dried, and the paper ply is positioned on the press skin.
Inventors:
Lanehoff, Ingo
Oldorf, Frank
Oldorf, Frank
Application Number:
JP2017525890A
Publication Date:
August 22, 2018
Filing Date:
October 09, 2015
Export Citation:
Assignee:
Flooring Technologies Ltd.
International Classes:
B44C5/04; B27D5/00; B27M3/00; E04F15/00
Domestic Patent References:
| JP2001191474A | ||||
| JP2008512592A | ||||
| JP2014139400A | ||||
| JP2009143038A |
Attorney, Agent or Firm:
Kurata Masatoshi
Nobuhisa Nogawa
Naoki Kono
Tadashi Inoue
Ukai Ken
Shigeru Iino
Nobuhisa Nogawa
Naoki Kono
Tadashi Inoue
Ukai Ken
Shigeru Iino