How to form coating patternized on parts

Title:

How to form coating patternized on parts

Document Type and Number:

Japanese Patent JP6187684

Kind Code:

B2

Abstract:

For producing a structured coating, or for carefully lifting off a coating over a sensitive region, it is proposed that a release film be applied and structured under the coating in the region which is not to be coated. In a release step, the release film is reduced in the adhesion in the region which is not to be coated and is subsequently lifted off together with the coating applied over it.

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Inventors:

Pearl, Wolfgang

Application Number:

JP2016520322A

Publication Date:

August 30, 2017

Filing Date:

May 12, 2014

Export Citation:

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Assignee:

tdk Corporation

International Classes:

B81C1/00; B81C3/00; H01L23/02; H04R19/04; H04R31/00

Domestic Patent References:

JP2013010342A
JP2011089048A
JP2009514691A

Foreign References:

DE102008041059A1
DE102004011148B3
US20100295139
US20130051598
US20130140656

Attorney, Agent or Firm:

Kimura Mitsuru
Takanori Mamoru
Taiji Morikawa
Kei Sakurada
Mie Hideki

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