Title:
フレキシブル回路基板を形成する方法
Document Type and Number:
Japanese Patent JP2009528700
Kind Code:
A
Abstract:
A method for forming a flexible circuit board includes placing an adhesive coated coverlay over a flexible media, placing a release film over the adhesive coated coverlay and compressing together the flexible media, the adhesive coated coverlay, and the release film. The flexible media includes circuitry. The release film includes a multi-layer film having first and second layers. The first layer includes an elastomer and the second layer includes a fluoropolymer.
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Inventors:
Sway, Gwoshin
Castellic, John Earl.
Ortiz, Paul W.
Castellic, John Earl.
Ortiz, Paul W.
Application Number:
JP2008557315A
Publication Date:
August 06, 2009
Filing Date:
February 23, 2007
Export Citation:
Assignee:
Saint-Gobain Performance Plastics Corporation
International Classes:
H05K3/28
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Atsushi Ebiya
Taiji Matsumoto
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Atsushi Ebiya
Taiji Matsumoto