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Title:
パッケージを形成するための方法
Document Type and Number:
Japanese Patent JP6495826
Kind Code:
B2
Abstract:
A method for forming a naked collation package comprising a) providing an arrangement of packages individually wrapped in a filmic material; b) providing a naked collation film for nakedly wrapping said individually wrapped packages, the naked collation film comprising a polyolefinic core layer C, an inner sealing layer A on the inner surface of the naked collation film and a polyolefinic outer sealing layer B on the outer surface of the naked collation film, the material of the inner sealing Layer A being selected for sealing incompatibility with the filmic material of the individually wrapped packages under a specified sealing condition and heat shrinking condition, and the polyolefinic material of the outer sealing layer B being selected for sealing compatibility with B end for sealing compatibility with A under the specified sealing condition, wherein layers A and B are formed of the same or different materials and layer B comprises et least one polyolefinic polymer and a slip promotion component comprising less than 0.2% by weight of the layer of silicone and a non-silicone component in an amount exceeding 0.1% by weight of the layer; c) arranging the individually wrapped packages in an ordered configuration; d) arranging the naked collation film such that it at least partially surrounds the ordered configuration of individually wrapped packages; and e) heat shrinking the naked collation film by exposing it to the heat shrinking condition, causing, the naked collation film to shrink and closely surround the arrangement of packages, without being sealed to the packages. Naked collation film wrapped packages are also disclosed.

Inventors:
Shin, Charendra
Application Number:
JP2015546092A
Publication Date:
April 03, 2019
Filing Date:
December 03, 2013
Export Citation:
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Assignee:
Innovia Films Limited
International Classes:
B65B11/00; B29C48/10; B29C48/95; B65B11/12; B65B53/00; B65D85/10; B29C48/08
Domestic Patent References:
JP2010536672A
Foreign References:
WO2012088567A1
Attorney, Agent or Firm:
Seiji Ohno
Kenichi Katayama