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Title:
超硬材料の多結晶層を形成する方法
Document Type and Number:
Japanese Patent JP4343271
Kind Code:
B2
Abstract:
A polycrystalline diamond layer is bonded to a cemented metal carbide substrate by this process. A layer of dense high shear compaction material including diamond or cubic boron nitride particles is placed adjacent to a metal carbide substrate. The particles of diamond have become rounded instead of angular due to high shear compaction in a multiple roller process. The volatiles in the high shear compaction material are removed and binder decomposed at high temperature, for example, 950 DEG C., leaving residual amorphous carbon or graphite in a layer of ultra hard material particles on the carbide substrate. The substrate and layer assembly is then subjected to a high pressure, high temperature process, thereby sintering the ultra hard particles to each other to form a polycrystalline ultra hard layer bonded to the metal carbide substrate. The layer of high shear compaction material is also characterized by a particle size distribution including larger and smaller particles that are distributed uniformly throughout the layer.

Inventors:
Anderson, Nathan Earl.
Ea, Ronald K.
Keshaban, Madapush Kay.
Rye, Gunsham
Application Number:
JP51144797A
Publication Date:
October 14, 2009
Filing Date:
September 09, 1996
Export Citation:
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Assignee:
Smith International, Inc.
International Classes:
B24D3/00; C04B37/00; B24D3/06; B24D3/28; B24D18/00; B28B3/12; B32B18/00; C04B35/52; C04B41/87; C04B41/89
Domestic Patent References:
JP7150878A
JP6316470A
JP63288664A
Foreign References:
US5211726
US4104441
US4931068
US3574580
US5379853
Attorney, Agent or Firm:
Takashi Ishida
Yoshio Yoshio
Toshio Toda
Masaya Nishiyama