Title:
How to form the terminal area used for bonding with a large diameter wire or a strip between a metal fabrication object and a power semiconductor
Document Type and Number:
Japanese Patent JP5955392
Kind Code:
B2
Abstract:
The invention relates to a method for connecting a power semi-conductor chip having upper-sided potential surfaces to thick wires or strips, consisting of the following steps: Providing a metal molded body corresponding to the shape of the upper-sided potential surfaces, applying a connecting layer to the upper-sided potential surfaces or to the metal molded bodies, and applying the metal molded bodies and adding a material fit, electrically conductive compound to the potential surfaces prior to the joining of the thick wire bonds to the non-added upper side of the molded body.
Inventors:
Becker, Martin
Ronald Aizele
Frank, Osterwald
Luzuki, Jacek
Ronald Aizele
Frank, Osterwald
Luzuki, Jacek
Application Number:
JP2014533779A
Publication Date:
July 20, 2016
Filing Date:
September 10, 2012
Export Citation:
Assignee:
Danfoss Silicon Power Game Beher
International Classes:
H01L23/48; H01L21/60; H01L23/12
Domestic Patent References:
| JP2008016818A |
Attorney, Agent or Firm:
Masaki Yamakawa
Shigeki Yamakawa
Shigeki Yamakawa
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