Title:
How to grind at least one wafer
Document Type and Number:
Japanese Patent JP5995825
Kind Code:
B2
Abstract:
The method involves providing a disk (5) made of semiconductor material on both front and rear sides between upper and lower polishing plates (8) that are supported with hard and light compressible polishing cloth (1). Distance between the upper and lower polishing plates, and an upper surface (2) of the polishing cloth stays in contact with disk to be polished. A polishing gap extends from an inner edge of the polishing cloth to an outer edge of the polishing cloth, where height of the polishing gap at the inner edge differs from a height of the polishing gap at the outer edge.
Inventors:
Claus Rutger
Alexander Heilmeier
Lestek Misuturu
Makoto Tabata
Bradymir Dutschke
Torsten Olbrich
Alexander Heilmeier
Lestek Misuturu
Makoto Tabata
Bradymir Dutschke
Torsten Olbrich
Application Number:
JP2013250042A
Publication Date:
September 21, 2016
Filing Date:
December 03, 2013
Export Citation:
Assignee:
Siltronic AG
International Classes:
H01L21/304; B24B37/08; B24B37/24; B24B53/00
Domestic Patent References:
| JP2002166357A | ||||
| JP2006344892A | ||||
| JP2012150865A | ||||
| JP2007021604A | ||||
| JP2008235899A | ||||
| JP8174404A |
Foreign References:
| US20120028547 |
Attorney, Agent or Firm:
Fukami patent office