Title:
【発明の名称】研削砥石、研削装置およびナイフを研削する方法
Document Type and Number:
Japanese Patent JP2003502164
Kind Code:
A
Abstract:
The invention relates to a grinding wheel for grinding a blade, on the surface of which ions are deposited by means of a plasma-supported method and containing silicon carbide as abrasive medium with a grain size ranging from 100 to 500 mesh, said material being deposited in a ceramic based binding agent with aluminum silicate. The abrasive medium grains are thermally hardened and bonded in the porous aluminum silicate bond. Abrasive medium concentration in the grinding wheel is higher than 1 volume %. Said grinding wheel is used in a grinding system for rough grinding the blade. Polishing is then cared out with a second grinding wheel containing pure corundum as abrasive medium with a grain size ranging from 400 to 800 mesh, which is deposited a in multicomponent synthetic resin, preferably a phenol resin based resin with a concentration of more than 1 volume %, preferably 30 to 50%. The abrasive medium contains polishing-active filling materials with a volume fraction ranging between 3% and 10%.
More Like This:
| WO/2002/085564 | SAW BLADE SHARPENING MACHINE |
| JP2003251549 | KITCHEN KNIFE SHARPENER |
| JPS527089 | ELECTRIC BLADE POLISHER USING SONIC WAVE |
Inventors:
Ulrich Schoff
Stephan Lyman
Berndray
Stephan Lyman
Berndray
Application Number:
JP2001504542A
Publication Date:
January 21, 2003
Filing Date:
May 17, 2000
Export Citation:
Assignee:
Jagenberg Puppy Atehnik Gesellschaft Mitt Beschlenktel Haftung
International Classes:
B24B3/36; B24D3/00; B24D3/02; B24D3/34; B24B3/54; B24D7/18; (IPC1-7): B24D3/00; B24B3/54; B24D3/02
Attorney, Agent or Firm:
Toshio Yano (4 outside)