Title:
保持面の研削方法
Document Type and Number:
Japanese Patent JP7048335
Kind Code:
B2
Abstract:
To make it possible to hold a wafer with a holding table such that the center of the wafer does not become thinner after the wafer is ground.SOLUTION: In a method of grinding a holding surface: a resin bond grinding stone made by mixing and solidifying diamond abrasive grains 16 into a resin bond 15 is used as a grinding stone 14; a rotation axis 100 at the center of a grinding wheel 13 and a rotation axis 200 at the center of a holding table 21 are relatively tilted to make a ground surface 14a contact with a holding surface 24a from the circumference E to the center C of the holding surface 24a; and when the ground surface 14a is in contact with the holding surface 24a, the holding surface 24a is ground from the circumference E to the center C with a grinding load applied on diamond abrasive grains 16 exposed to the ground surface 14a, and the holding surface is ground from the center C to a radial outer side with no grinding load applied on diamond abrasive grains 16 for the ground surface 14a passed through the center C, thus a recessed portion 25 being formed at the center of the holding surface 24a. As a result, the wafer can be held by the holding surface 24a with no gap to thereby allow the wafer to be ground to a uniform thickness.SELECTED DRAWING: Figure 2
Inventors:
Yukiko Kikawa
Takeshi Nagai
Takeshi Nagai
Application Number:
JP2018016318A
Publication Date:
April 05, 2022
Filing Date:
February 01, 2018
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B41/06; B24B7/04
Domestic Patent References:
| JP2008114336A | ||||
| JP2007059949A |
Foreign References:
| US20170207108 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office