Title:
How to grind a semiconductor wafer by simultaneous double-sided polish
Document Type and Number:
Japanese Patent JP5957483
Kind Code:
B2
Inventors:
Reiner Baumann
Johannes Stouthamer
Alexander Heilmeier
Lestek Misuturu
Claus Rutger
Johannes Stouthamer
Alexander Heilmeier
Lestek Misuturu
Claus Rutger
Application Number:
JP2014081743A
Publication Date:
July 27, 2016
Filing Date:
April 11, 2014
Export Citation:
Assignee:
Siltronic AG
International Classes:
H01L21/304; B24B37/00; B24B53/00
Foreign References:
| US20020160689 | ||||
| US6338672 | ||||
| WO2010128631A1 |
Attorney, Agent or Firm:
Fukami patent office