How to grind using the polish combination thing which can be adjusted - Rohm and Haas Electronic Materials CMP Housings, Inc.

Title:

How to grind using the polish combination thing which can be adjusted

Document Type and Number:

Japanese Patent JP6021584

Kind Code:

B2

Abstract:

A process for chemical mechanical polishing of a substrate having a polysilicon overburden deposited over silicon nitride is provided using multiple dilutions of a chemical mechanical polishing composition concentrate to polish the substrate, wherein a first dilution of the concentrate used to polish the substrate is tuned to exhibit a first polysilicon removal rate and a first polysilicon to silicon nitride removal rate selectivity; and wherein a second dilution of the concentrate used to polish the substrate is tuned to exhibit a second polysilicon removal rate and a second polysilicon to silicon nitride removal rate selectivity.

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Inventors:

Lee Guo
Kanchara-Arun Kumar Lady

Application Number:

JP2012235708A

Publication Date:

November 09, 2016

Filing Date:

October 25, 2012

Export Citation:

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Assignee:

Rohm and Haas Electronic Materials CMP Housings, Inc.

International Classes:

H01L21/304; B24B37/00; C09K3/14

Domestic Patent References:

JP2010267960A
JP2010067681A
JP2006120749A
JP2005072238A
JP2007103515A
JP2011216582A

Foreign References:

US20080119051

Attorney, Agent or Firm:

Patent business corporation Tsukuni
Hajime Tsukuni
Yasuo Yanagibashi
Keiko Ozawa
Toshio Miyake
Yasuhiro Oguni
Yoko Tanaka
Yoshinori Ikukawa
Akio Shibata

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