Title:
ワークピースの研削方法
Document Type and Number:
Japanese Patent JP7427327
Kind Code:
B2
Abstract:
To provide a workpiece grinding method which can achieve small variations of thickness occurring in a non-circular workpiece.SOLUTION: In a workpiece grinding method, a grind stone is placed in contact with a ground surface of a non-circular workpiece in a state that a holding table holding the workpiece and a grinding wheel, to which a grind stone for grinding is fixed, are rotated to grind the workpiece. The workpiece grinding method includes: a first grinding step in which the workpiece is ground so that a load acting from the grind stone to the workpiece becomes a first value; and a second grinding step in which the workpiece is ground so that the load changes from a second value smaller than the first value to a third value larger than the second value and smaller than the first value.SELECTED DRAWING: Figure 5
Inventors:
Keisuke Yamamoto
Application Number:
JP2019230084A
Publication Date:
February 05, 2024
Filing Date:
December 20, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B7/04; B24B47/12; B24B49/16; H01L21/304
Domestic Patent References:
| JP2016150421A | ||||
| JP5285806A | ||||
| JP1143343U | ||||
| JP2016097476A |
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
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