To provide an electronic component in which a terminal section is plated with lead-free solder, and to provide a method and a device for processing the component by which the terminal of the electronic component can be plated with the lead-free solder and the component can be adapted to a mounting process using the lead-free solder.
A coil 1 is composed of a coil bobbin 2, a coil wire 3, and a portion 4 which becomes the terminal through succeeding steps. Generally, the coil wire 3 is a coated wire obtained by coating the surface of a wire containing copper as the main component with a resin and called as the enameled wire. A handler 5 which handles the coil 1 as an electronic component can move in the directions shown by the arrows in the figure and can move upward and downward in a state where the handler 5 catches the coil 1. A micro-plasma source 6 is connected with a gas supplying device 7 and a power source 8, and can remove the enamel coating film from the portion 4 as the terminal by locally generating plasma.
COPYRIGHT: (C)2005,JPO&NCIPI
Kenichiro Suetsugu
Keiji Kawazoe
Mitsuo Saito
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Hiroki Naito
Daisuke Nagano