How to heat-treat a substrate, thermal treatment equipment, and the recording medium in which computer reading is possible

Title:

How to heat-treat a substrate, thermal treatment equipment, and the recording medium in which computer reading is possible

Document Type and Number:

Japanese Patent JP5995892

Kind Code:

B2

Inventors:

Yasuo Mori
Kenichi Shigetomi

Application Number:

JP2014052299A

Publication Date:

September 21, 2016

Filing Date:

March 14, 2014

Export Citation:

Assignee:

東京エレクトロン株式会社

International Classes:

H01L21/66; F27D19/00; H01L21/02

Domestic Patent References:

Attorney, Agent or Firm:

Yoshiki Hasegawa
Yoshiki Kuroki
Junji Kashiwaoka
Toshiaki Matsuzawa

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